창고: HONGKONG
날짜 코드: 최신 Date Code
제조업체 표준 리드 타임: 5 주
내부 부품 번호 | EIS-B260A() | |
무연 여부 / RoHS 준수 여부 | 무연 / RoHS 준수 | |
수분 민감도 레벨(MSL) | 1(무제한) | |
생산 현황 (라이프 사이클) | 생산 중 | |
관련 링크 | B260A�, B260A() 데이터 시트, - 에이전트 유통 |
![]() | TR3E336M025C0175 | 33µF Molded Tantalum Capacitors 25V 2917 (7343 Metric) 175 mOhm 0.287" L x 0.169" W (7.30mm x 4.30mm) | TR3E336M025C0175.pdf | |
![]() | MLG0402Q2N2CT000 | 2.2nH Unshielded Multilayer Inductor 200mA 800 mOhm Max 01005 (0402 Metric) | MLG0402Q2N2CT000.pdf | |
![]() | 60831A083 | 60831A083 Beagla DIP14 | 60831A083.pdf | |
![]() | ABDDZN7000SV1 | ABDDZN7000SV1 ORIGINAL NA | ABDDZN7000SV1.pdf | |
![]() | CL05B221KBNC | CL05B221KBNC SAMSUNG SMD or Through Hole | CL05B221KBNC.pdf | |
![]() | HEAT SINK 28X28X7.9MM | HEAT SINK 28X28X7.9MM HSINWEI DIP | HEAT SINK 28X28X7.9MM.pdf | |
![]() | NCP34331G | NCP34331G ON SOP16 | NCP34331G.pdf | |
![]() | 25V2200-HLV | 25V2200-HLV UCC SMD or Through Hole | 25V2200-HLV.pdf | |
![]() | BCM-BCM53312SB0IPBG-SH | BCM-BCM53312SB0IPBG-SH BCM SMD or Through Hole | BCM-BCM53312SB0IPBG-SH.pdf | |
![]() | LVY2640-PF | LVY2640-PF LIGITEK ROHS | LVY2640-PF.pdf | |
![]() | CR10-33R0-FK | CR10-33R0-FK ASJ SMD or Through Hole | CR10-33R0-FK.pdf | |
![]() | IBM25PPC750GXECB6583T | IBM25PPC750GXECB6583T IBM BGA | IBM25PPC750GXECB6583T.pdf |